Berkeley Lab startup company Newomics Inc. developing technology for personalized health care
The promise of being able to quickly and accurately screen for diseases or chemical contaminants in a tiny drop of blood has long been an elusive goal. But scientist Daojing Wang says his company’s technology is up to the job. (more…)
Researchers from North Carolina State University have for the first time integrated a material called bismuth ferrite (BFO) as a single crystal onto a silicon chip, opening the door to a new generation of multifunctional, smart devices.
BFO has both ferromagnetic and ferroelectric properties, meaning that it can be magnetized by running an electric current through the material. Potential applications for BFO include new magnetic memory devices, smart sensors and spintronics technologies. (more…)
• From the Lab to the Fab: Technology Breakthrough Demonstrates Feasibility of Silicon Nanophotonics for Chip Manufacturing
• Light Pulses Can Move Data at Blazing Speeds to Help Solve Bandwidth Limitations of Servers, Datacenters and Supercomputers
• After More Than a Decade of Research, Silicon Nanophotonics is Ready for Development of Commercial Applications
SAN FRANCISCO, Calif. – 10 Dec 2012: IBM announced today a major advance in the ability to use light instead of electrical signals to transmit information for future computing. The breakthrough technology – called “silicon nanophotonics” – allows the integration of different optical components side-by-side with electrical circuits on a single silicon chip using, for the first time, sub-100nm semiconductor technology.
Silicon nanophotonics takes advantage of pulses of light for communication and provides a super highway for large volumes of data to move at rapid speeds between computer chips in servers, large datacenters, and supercomputers, thus alleviating the limitations of congested data traffic and high-cost traditional interconnects. (more…)
ANN ARBOR, Mich.— A hidden facet of a math problem that goes back to timeworn Sanskrit manuscripts has just been exposed by nanotechnology researchers at the University of Michigan and the University of Connecticut.
It turns out we’ve been missing a version of the famous “packing problem,” and its new guise could have implications for cancer treatment, secure wireless networks, microelectronics and demolitions, the researchers say.
Called the “filling problem,” it seeks the best way to cover the inside of an object with a particular shape, such as filling a triangle with discs of varying sizes. Unlike the traditional packing problem, the discs can overlap. It also differs from the “covering problem” because the discs can’t extend beyond the triangle’s boundaries. (more…)
*Touch-centric interface and application experience designed as a natural reflection of the device.*
TAIPEI, Taiwan — June 2, 2011 — At 2011 Computex today, Microsoft Corp. showed hardware partners the next version of Windows, internally code-named “Windows 8,” to help the partners build devices that take advantage of the new user experience. As part of this technical preview, Mike Angiulo, corporate vice president of Windows Planning, Hardware and PC Ecosystem at Microsoft, demonstrated how “Windows 8” is optimized for newer touch-centric hardware, including tablets, while still delivering the flexibility, connectivity and power that people have come to expect from Windows today.
The technical demonstration also highlighted the new operating system’s ability to work across both x86 and ARM-based architectures, with a variety of early prototypes shown running the new operating system. Microsoft and silicon chip makers AMD, Intel Corporation, NVIDIA Corp., Qualcomm Inc. and Texas Instruments Inc. initially announced plans in January to work together on the next version of Windows. (more…)
