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Made in IBM Labs: Researchers Unveil Nanotechnology Circuits for Wireless Devices

By Guest PostJune 10, 2011Technology10 gigahertz, binnig and rohrer nanotechnology center, bio analytics, broadband frequency, building block, carbon electronics for rf applications, cell phone, cera, chemical vapor deposited grapheme, cvd, cvd grapheme, energy technology, eth zurich, fabrication of graphene circuits, grapheme based analog integrated circuit, graphene, honeycomb structure, ibm research, integrated circuit, nanoscale research, Nanotechnology, novel material, radiation, sic, silicon carbide wafer, single layer of carbon atoms, smart phones, solar energy, t c chen, thinnest electronic material, wafer size grapheme, water purification, wireless communications, wireless devices, x-rays

*Scientists Build the First Wafer-Scale Graphene Integrated Circuit Smaller than a Pinhead*

Yorktown Heights, NY – 10 Jun 2011: Today, IBM Research scientists announced that they have achieved a milestone in creating a building block for the future of wireless devices. In a paper published yesterday in the magazine Science, IBM researchers announced the first integrated circuit fabricated from wafer-size graphene, and demonstrated a broadband frequency mixer operating at frequencies up to 10 gigahertz (10 billion cycles/second).

Designed for wireless communications, this graphene-based analog integrated circuit could improve today’s wireless devices and points to the potential for a new set of appli-cations. At today’s conventional frequencies, cell phone and transceiver signals could be improved, potentially allowing phones to work where they can’t today while, at much higher frequencies, military and medical personnel could see concealed weapons or conduct medical imaging without the same radiation dangers of X-rays. (more…)

Made in IBM Labs: Breakthrough Chip Technology Lights the Path to Exascale Computing

*IBM Silicon Nanophotonics uses optical signals to connect chips together faster and with lower power*

Yorktown Heights, N.Y. – 01 Dec 2010: IBM scientists today unveiled a new chip technology that integrates electrical and optical devices on the same piece of silicon, enabling computer chips to communicate using pulses of light (instead of electrical signals), resulting in smaller, faster and more power-efficient chips than is possible with conventional technologies.

The new technology, called CMOS Integrated Silicon Nanophotonics, is the result of a decade of development at IBM’s global Research laboratories. The patented technology will change and improve the way computer chips communicate – by integrating optical devices and functions directly onto a silicon chip, enabling over 10X improvement in integration density than is feasible with current manufacturing techniques. (more…)

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Made in IBM Labs: Researchers Unveil Nanotechnology Circuits for Wireless Devices

Made in IBM Labs: Breakthrough Chip Technology Lights the Path to Exascale Computing